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Research Interests

Papers共 231 篇Author StatisticsCo-AuthorSimilar Experts

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Next Generation Co-Packaged Optics Technology to Train Run Generative AI Models in Data Centers and Other Computing Applications
John Knickerbocker,Jean Benoit Heroux, Griselda Bonilla, Hsiang Hsu, Neng Liu, Adrian Paz Ramos, Francois Arguin, Yan Tribodeau, Badr Terjani,Mark Schultz, Raghu Kiran Ganti, Linsong Chu,Chinami Marushima, Yoichi Taira,Sayuri Kohara,Akihiro Horibe,Hiroyuki Mori,Hidetoshi Numata
arxiv（2024）
Cited0Views0Bibtex
0
0
Voids-free Die-level Cu/ILD Hybrid Bonding
Katsuyuki Sakuma,Roy Yu, Nicholas Polomoff, Luke Darling, Promod Chowdhury,Sathya Raghavan, Keodara Seifert,John Knickerbocker,Dale McHerron,Ming Li,Siu Cheung So, So Ying Kwok,Chun Ho Fan,Siu Wing Lau
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.800-805, (2023)
Cited5Views0EIWOSBibtex
5
0
Thermal Solution for Co-Packaged Optics (CPO) Modules
Keiji Matsumoto,Mukta Farooq,John Knickerbocker
2022 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) (2022)
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Author Statistics

#Papers: 231

#Citation: 7839

H-Index: 43

G-Index: 70

Sociability: 6

Diversity: 1

Activity: 0

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