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Bio
His research areas include thin film metallic glasses, multilayer and interface study, low density high entropy alloys, 3D printing additive manufacture, biocompatible implant-used gradient porous Ti foams, and nanocrystalline materials. He has published more than 300 journal papers, and many conference papers and patents. Professor Jacob C. Huang’s most significant contribution in worldwide basis might be his pioneer starting research in low temperature superplasticity (LTSP) and thin film metallic glasses (TFMG). In addition, he has devoted to the realization and promotion of academic research to the industrial application in Taiwan. For example, he developed thermomechanical treatments on various Al alloys for China Steel Corp-Aluminum Corp, Taiwan. He also developed forming techniques for Mg and Al enclosures for cell phones and laptop computers for Catcher and Foxconn Corp, two of the world largest supplier for metal casings for Apples I-Phone, Acer Computer, Asus Computer, and HTC cell phone Companies. In the past five years, he developed thin film metallic glass coatings for optical and thermal devices and effectively transferred the technology to several local companies. His recent progress on 3D printing additive manufacture of TiZrTaSi based biocompatible graded porous foams for replacement of human cortical and cancellous spine bone has been exciting.
Research Interests
Papers共 544 篇Author StatisticsCo-AuthorSimilar Experts
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MATERIALS TODAY COMMUNICATIONS (2024)
JOURNAL OF ELECTROANALYTICAL CHEMISTRY (2024)
Journal of Physics Conference Seriesno. 8 (2024): 082020-082020
T. H. Chou,W. P. Li, L. Y. Zhu, F. Zhu, X. C. Li,J. Huang, Y. X. Wang, R. Zhou, W. Y. Chen,J. H. Luan,Y. L. Zhao, Z. X. Wu,F. R. Chen,J. C. Huang,P. K. Liaw, X. L. Wang,T. Yang
Materials Today Communicationspp.109702-109702, (2024)
Corrosion Science (2023): 111624-111624
S. Liao,L. Yang, T.K. Chiu,W.X. You, T.Y. Wu,K.F. Yang,W.Y. Woon,W.D. Ho, Z.C. Lin,H.Y. Hung,J.C. Huang,S.T. Huang, M.C. Tsai,C.L. Yu, S.H. Chen, K.K. Hu,C.C. Shih, Y.T. Chen, C.Y. Liu, H.Y. Lin, C.T. Chung, L. Su, C.Y. Chou, Y.T. Shen, C.M. Chang, Y.T. Lin,M.Y. Lin, W.C. Lin, B.H. Chen,C.S. Hou, F. Lai, X. Chen, J. Wu,C.K. Lin,Y.K. Cheng,H.T. Lin,Y.C. Ku,S.S. Lin, L.C. Lu,S.M. Jang,M. Cao
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2023): 7654-7665
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Author Statistics
#Papers: 563
#Citation: 18839
H-Index: 60
G-Index: 115
Sociability: 7
Diversity: 4
Activity: 92
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