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个人简介
Research topics: Focus on microelectronics (IMEC)
- Thermo-mechanical material analysis.
- Finite element modeling
- Optical, electrical and thermal functional- and reliability testing
- Electromigration testing
- Environmental reliability testing (temperature, humidity, shock and vibration), sample preparation and failure analysis.
These activities cover a broad application level in the microelectronics domain: Cu/low k, 3D integration (wafer level packaging, stacked ICs), MEMS (both RF and above IC (SiGe) MEMS), next generation Si device packaging, flexible and stretchable substrates, IC-package and board.
- Thermo-mechanical material analysis.
- Finite element modeling
- Optical, electrical and thermal functional- and reliability testing
- Electromigration testing
- Environmental reliability testing (temperature, humidity, shock and vibration), sample preparation and failure analysis.
These activities cover a broad application level in the microelectronics domain: Cu/low k, 3D integration (wafer level packaging, stacked ICs), MEMS (both RF and above IC (SiGe) MEMS), next generation Si device packaging, flexible and stretchable substrates, IC-package and board.
研究兴趣
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Journal of Optical Microsystemsno. 01 (2024)
Fluidsno. 3 (2024): 69
Solid-State Electronics (2024): 108867
SOLID-STATE ELECTRONICS (2024)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
IEEE Transactions on Electron Devicesno. 12 (2023): 6512-6519
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-10, (2023)
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Pietro Rinaudo, A. Chasin,J. Franco, Z. Wu, S. Subhechha, G. Arutchelvan, G. Eneman, B. Y. V. Ramana, N. Rassoul, R. Delhougne, B. Kaczer,I. De Wolf,
IEEE Transactions on Device and Materials Reliabilityno. 3 (2023): 337-345
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2023 IEEE International Reliability Physics Symposium (IRPS)pp.1-7, (2023)
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