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Development of Lead-free solder alloys for electronic packaging by thermodynamic calculation, Synthesis of conductive nanoparticles for ink-jet printing, and research about the properties of catalysis by computer simulation technique in multi-scale.
Development of Lead-free solder alloys for electronic packaging by thermodynamic calculation, Synthesis of conductive nanoparticles for ink-jet printing, and research about the properties of catalysis by computer simulation technique in multi-scale.
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论文共 268 篇作者统计合作学者相似作者
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Jun Seok Ha,Youngtae Park,Jae-Yeop Jeong,Seung Hun Lee, Sung Jun Lee,In Tae Kim, Seo Hyun Park,Hyunsoo Jin, Soo Min Kim, Suwon Choi,Chiho Kim,Sung Mook Choi,
Advanced science (Weinheim, Baden-Wurttemberg, Germany)pp.e2401782-e2401782, (2024)
MATERIALS CHEMISTRY AND PHYSICS (2024): 128727
Engineering (2023): 127-137
Chemical Engineering Journal (2023): 145150
Nature Communicationsno. 1 (2023): 1-11
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APPLIED CATALYSIS B-ENVIRONMENTAL (2023): 123128-123128
Changsoo Lee,Kihyun Shin,Young-Tae Park, Young Hwa Yun,Gisu Doo, Gi Hong Jung,Min-Joong Kim,Won Chul Cho,Chang Hee Kim,Hyuck Mo Lee,Hyun You Kim, Sechan Lee,
Advanced Functional Materialsno. 25 (2023)
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