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个人简介
Hyengcheul Choi received the B.S., M.S., and Ph.D. degrees in electrical engineering from Hanyang University, Seoul, South Korea, in 2005, 2007, and 2011, respectively.
From 2011 to 2020, he was a Senior Engineer and a Chief Engineer with LG Electronics, Seoul, participating and leading advanced research and development tasks about antennas of mobile handsets, 2G/3G/4G amplifiers for automotives, electromagnetic interference (EMI)/EMC solutions of PCB, and wireless power transfer systems. In 2020, he joined Corning, Gimcheon, South Korea, as a Principal Engineer, where he has researched antennas, metasurface, and reconfigurable intelligent surface (RIS) using glass for 5G/6G communications. He has authored or coauthored 16 peer-reviewed journals. He holds more than 55 granted patents. His recent research interests include designs of RIS, transparent antennas, antenna in package (AiP), substrate-integrated waveguide (SIW), and RF-based wireless charging systems.
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IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATIONno. 12 (2023): 9415-9423
2022 14th Global Symposium on Millimeter-Waves & Terahertz (GSMM)pp.85-88, (2022)
2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS/URSI)pp.1867-1868, (2021)
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