陳宏明 - Department of Electronics and Electrical Engineering, National Yang Ming Chiao Tung University;Institute of Electronics, National Yang Ming Chiao Tung University;College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University | 人才画像 - AMiner

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基本信息

浏览量：181

职业迁徙

个人简介

Nanometer physical design and automation. Chip-package-system codesign and cooptimization. 3D Integration. Design for manufacturability and reliability.

Teaching
Current Teaching
Object-Oriented Programming (Freshmen)
Advanced Algorithms (Graduate)
Past Teaching
Introduction to Comupters and Programming (Freshmen)
Assembly Language (Sophomore)
Data Structure (Sophomore)
Digital Circuits and Systems (with Verilog) (Sophomore)
Discrete Mathematics (Sophomore)
Introduction to Electronic Design Automation (Junior and Senior)
VLSI Design for Manufacturability (Graduate)
Special Topics on CAD (Synthesis and Verification) (Graduate)
VLSI Physical Design Automation (Graduate)

研究兴趣

论文共 282 篇作者统计合作学者相似作者

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On Awareness of Offset-Via and Teardrop in Advanced Packaging Interconnect Synthesis

Hao-Ju Chang, Yu-Hung Chen, Hao-Wei Huang, Yihua Yeh,Hung-Ming Chen, Chien-Nan Jimmy Liu

Asia and South Pacific Design Automation Conferencepp.774-780, (2025)

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Mixed-Size Placement Prototyping Based on Reinforcement Learning with Semi-Concurrent Optimization

Cheng-Yu Chiang, Yi-Hsien Chiang, Chao-Chi Lan, Yang Hsu, Che-Ming Chang, Shao-Chi Huang, Sheng-Hua Wang,Yao-Wen Chang,Hung-Ming Chen

Asia and South Pacific Design Automation Conferencepp.893-899, (2025)

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GIRD: A Green IR-Drop Estimation Method

Chee-An Yu, Yu-Tung Liu, Yu-Hao Cheng, Shao-Yu Wu,Hung-Ming Chen,C.-C. Jay Kuo

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systemsno. 99 (2025): 1-1

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Enabling System Design in 3D Integration: Technologies and Methodologies

PROCEEDINGS OF THE 2024 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, ISPD 2024（2024）

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Elevated-Epi (elepi) Technique for 3D IC with Stacked FinFETs, Interlevel Metal, and 25 $\times$ 33 Mm$^{\text{2}}$ Single-Crystalline Silicon on SiO$_\text{2}$

Bo-Jheng Shih,Yu-Ming Pan,Hao-Tung Chung, Chieh-Ling Lee,I-Chun Hsieh,Nein-Chih Lin,Chih-Chao Yang,Po-Tsang Huang,Hung-Ming Chen,Chiao-Yen Wang,Huan-Yu Chiu,Huang-Chung Cheng,Chang-Hong Shen,Kuan-Neng Chen,Chenming Hu

IEEE Transactions on Electron Devicespp.1-6, (2024)

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3DIC with Stacked FinFET, Inter-Level Metal, and Field-Size ($\mathbf{25}\times \mathbf{33}\mathbf{mm}^{\mathbf{2}}$) Single-Crystalline Si on SiO2 by Elevated-Epi

Bo-Jheng Shih,Yu-Ming Pan, Hsiao-Jen Chung, C. Lee,I-Chun Hsieh,Nein-Chih Lin,Chih-Chao Yang,Po-Tsang Huang,Hung-Ming Chen,Chiao-Yen Wang, Han-Lun Chiu,Huang–Chung Cheng,Chang-Hong Shen,Wen-Fa Wu,Tuo‐Hung Hou,Kuan‐Neng Chen,Chenming Hu

openalex（2024）

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Elevated-Epi (elepi) Technique for 3D IC with Stacked FinFETs, Interlevel Metal, and 25 X 33 Mm2 Single-Crystalline Silicon on SiO2

Bo-Jheng Shih,Yu-Ming Pan,Hao-Tung Chung, Chieh-Ling Lee,I-Chun Hsieh,Nein-Chih Lin,Chih-Chao Yang,Po-Tsang Huang,Hung-Ming Chen,Chiao-Yen Wang,Huan-Yu Chiu,Huang-Chung Cheng,Chang-Hong Shen,Kuan-Neng Chen,Chenming Hu

IEEE TRANSACTIONS ON ELECTRON DEVICES (2024)

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Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology

Wei Lu, Jie Zhang, Yi-Hui Wei,Hsu-Ming Hsiao,Sih-Han Li,Chao-Kai Hsu,Chih-Cheng Hsiao, Feng-Hsiang Lo,Shyh-Shyuan Sheu,Chin-Hung Wang,Wei-Chung Lo,Shih-Chieh Chang,Hung-Ming Chen,Kuan-Neng Chen,Po-Tsang Huang

Symposium on VLSI Technologypp.1-2, (2024)

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Mitigating Power and Process Variation for Analog CIM Design Migration

Shih-Han Chang, Shih-Yu Chen, Chun-Wen Yang, Hau-Wei Huang, Yu-Cheng Yang, Wei-Liang Chen,Chien-Nan Liu,Hung-Ming Chen

International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Designpp.1-4, (2024)

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On DRC Cleanness of Cell Porting for Design Migrations in Foundries and Technologies

Ching-Ying Wang, Chen-Ho Chen, Po-Hsiang Chang, Chien-Yu Hsieh, Ching-Feng Su, Scott Ji,Chien-Nan Jimmy Liu,Hung-Ming Chen

2024 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI TSA (2024)

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