基本信息
views: 86

Bio
Huai-Yu Cheng (M’11) received the B.S., M.S., and Ph.D. degrees in materials science and engineering from National Tsing Hua University, Hsinchu, Taiwan, in 2001, 2003, and 2007, respectively.
In 2007, she joined Macronix International Company Ltd., Hsinchu, where she is currently a Senior Researcher, based in Yorktown Heights, NY, USA. Her current research interests include phase change materials and selector materials for 3-D crosspoint memory.
Research Interests
Papers共 102 篇Author StatisticsCo-AuthorSimilar Experts
By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Wei-Chih Chien, J. X. Zheng,C. W. Yeh,Lynne M. Gignac,H. Y. Cheng, Z. L. Liu, Alexander Grun, C. L. Sung,E. K. Lai, S. Cheng,C. W. Cheng,L. Buzi,A. Ray, Douglas M. Bishop,Robert L. Bruce,M. J. BrightSky,H. L. Lung
Symposium on VLSI Technologypp.1-2, (2024)
Zhi-Lun Liu, Alexander Grun,Wei-Chih Chien,Asit Ray,Erh-Kun Lai,I-Ting Kuo,Lynne Gignac,Christian Lavoie,Matt Brightsky,Hsiang-Lan Lung,Huai-Yu Cheng
SCIENTIFIC REPORTSno. 1 (2024)
H. Y. Cheng, Z. L. Liu, A. Majumdar, Alexander Grun,A. Ray, J. Su,Malte J. Rasch,Fabio Carta,Lynne M. Gignac,C. Lavoie,C. W. Cheng, M. Bright Sky,H. L. Lung
Symposium on VLSI Technologypp.1-2, (2024)
W. C. Chien, C. L. Sung,R. L. Bruce,C. W. Yeh,H. Y. Cheng, Z. L. Liu,E. K. Lai,C. W. Cheng, J. X. Zheng,A. Grun,A. Ray,D. Daudelin,H. Y. Ho,M. BrightSky,H. L. Lung
2024 IEEE INTERNATIONAL MEMORY WORKSHOP, IMW (2024)
A. Grun, Z. L. Lui,C. W. Cheng, D. Piatek,E. K. Lai, Y. T. Kuo,W. C. Chien, S. Cheng,M. BrightSky,H. L. Lung,H. Y. Cheng
2024 IEEE INTERNATIONAL MEMORY WORKSHOP, IMW (2024)
Guy M. Cohen,Amlan Majumdar,Cheng-Wei Cheng,Asit Ray, Daniel Piatek,Lynne Gignac,Christian Lavoie, Alexander Grun,Huai-Yu Cheng, Zhi-Lun Liu,Hsiang-Lan Lung,Hiroyuki Miyazoe,Robert L. Bruce,Matthew Brightsky
PHYSICA STATUS SOLIDI-RAPID RESEARCH LETTERSno. 10 (2024)
2023 IEEE INTERNATIONAL MEMORY WORKSHOP, IMWpp.61-64, (2023)
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)pp.327-329, (2022)
6TH IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2022)pp.327-329, (2022)
Load More
Author Statistics
#Papers: 102
#Citation: 2618
H-Index: 28
G-Index: 47
Sociability: 6
Diversity: 2
Activity: 1
Co-Author
Co-Institution
D-Core
- 合作者
- 学生
- 导师
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn