The Thermal Modeling and Characterization team’s R&D activities focus on the understanding of the thermal behavior and cooling needs in electronic systems. We have the ambition to study these aspects at all relevant length scales ranging from the device level (nm) all the way to the system level, for a very wide range of applications such as advanced packaging, 3D stacking technology, nano-interconnect, silicon photonics, scaled transistors, RF and GaN. To support the imec technology programs and projects, we characterize the thermal performance of new technologies, improve the thermal design and develop novel, integrated cooling solutions, using a combination of numerical modeling (Monte Carlo BTE, FEM, CFD) and experimental thermal characterization techniques.