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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 365 篇作者统计合作学者相似作者

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Integration of HfO2-based 3D OxRAM with GAA stacked-nanosheet transistor for high-density embedded memory
T. Dubreuil, S. Barraud, J. -M. Pedini,J. -M. Hartmann, F. Boulard, A. Sarrazin, A. Gharbi, J. Sturm, A. Lambert,S. Martin, N. Castellani, A. Anotta,
IEEE 53RD EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE, ESSDERC 2023pp.117-120, (2023)
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Direct Band Gap Ge0.85Sn0.15 Photodiodes for Room Temperature Gas Sensing
C. Cardoux, L. Casiez, M. Frauenrath,N. Pauc, V. Calvo,J. M. Hartmann, N. Coudurier,P. Rodriguez, P. Grosse, C. Constancias, O. Lartigue, P. Barritault,
2023 IEEE SILICON PHOTONICS CONFERENCE, SIPHOTONICS (2023)
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Optimizing RFSOI Performance through a T-shaped Gate and Nano-Second Laser Annealing Techniques
L. Lucci, S. Cremer, B. Duriez, T. Fache, S. Kerdiles, Y. Morand,J. -M. Hartmann, J. Azevedo-Goncalves, F. Gaillard, P. Chevalier
2023 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM, RFICpp.61-64, (2023)
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Integration of HfO2-based 3D OxRAM with GAA stacked-nanosheet transistor for high-density embedded memory
T. Dubreuil, S. Barraud, J.-M. Pedini,J.-M. Hartmann, F. Boulard, A. Sarrazin, A. Gharbi, J. Sturm, A. Lambert,S. Martin, N. Castellani, A. Anotta,
ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)pp.117-120, (2023)
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Advances in In Situ Boron and Phosphorous Doping of SiGeSn
M. Frauenrath, O. Concepcion,N. Gauthier,E. Nolot,D. Buca,J. -M. Hartmann
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGYno. 6 (2023): 064001-064001
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Very Low Temperature Tensile and Selective Si:P Epitaxy for Advanced CMOS Devices
Joël Kanyandekwe,Matthias Bauer,Tanguy Marion, Lazhar Saidi, Jean-Baptiste Pin, Jeremie Bisserier,Jérôme Richy,Nicolas Gauthier,Pattamon Dezest,Laurent Brunet, Valérie Lapras, Tristan Dewolf,
ECS Transactionsno. 32 (2022): 1190-1190
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Trench filling with phosphorus-doped monocrystalline and polycrystalline silicon
J. Lespiaux, F. Deprat, B. Rodrigues Goncalves, J. Souc,F. Leverd,M. Juhel, J-G Mattei, C. Giroud-Garampon,A. Roman, T. Magis,J. M. Hartmann
Materials Science in Semiconductor Processing（2022）
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