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论文共 90 篇作者统计合作学者相似作者
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Kirsten Weide-Zaage, Satria-Jaya Mandala, Eike Trumann,Guillermo Payá-Vayá, Dorian von Wolff, Andre Bausen, Alexander Müller
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-4, (2024)
Eike Trumann,Gia Bao Thieu, Johannes Schmechel,Kirsten Weide-Zaage, Dorian von Wolff, Andre Bausen, Alexander Müller,Guillermo Payá-Vayá
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2024)
Gia Bao Thieu,Sven Gesper,Guillermo Paya-Vaya,Christoph Riggers, Oliver Renke, Till Fiedler, Jakob Marten,Tobias Stuckenberg,Holger Blume, Christian Weis, Lukas Steiner, Chirag Sudarshan,
2023 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, DATEpp.1-6, (2023)
Sven Gesper, Gia Bao Thieu, Daniel Köhler, Markus Kock, Tim Berthold, Oliver Renke,Holger Blume,Guillermo Payá Vayá
International Conference on Consumer Electronics - Berlinpp.94-99, (2023)
Eike Trumann,Gia Bao Thieu, Johannes Schmechel,Kirsten Weide-Zaage,Katharina Schmidt, Dorian Hagenah,Guillermo Paya Vaya
APPLIED RECONFIGURABLE COMPUTING. ARCHITECTURES, TOOLS, AND APPLICATIONS, ARC 2023 (2023): 357-360
Gia Bao Thieu, Johannes Schmechel,Kirsten Weide-Zaage,Katharina Schmidt, Dorian Hagenah,Guillermo Payá-Vayá
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
APPLIED RECONFIGURABLE COMPUTING. ARCHITECTURES, TOOLS, AND APPLICATIONS, ARC 2023 (2023): 307-321
2023 IEEE 34th International Conference on Application-specific Systems, Architectures and Processors (ASAP)pp.61-68, (2023)
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Sven Gesper,Gia Bao Thieu,Daniel Köhler, Markus Kock, Tim Berthold, Oliver Renke,Holger Blume,Guillermo Payá-Vayá
2023 IEEE 13th International Conference on Consumer Electronics - Berlin (ICCE-Berlin)pp.94-99, (2023)
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