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Francy Akkara received the B.S. degree in electronics and communication engineering from Mahatma Gandhi University, Kerala, India, and the M.S. degree in electrical engineering from Auburn University, Auburn, AL, USA, in 2015, where he is currently pursuing the Ph.D. degree in industrial and systems engineering.
His current research interests include lead-free solder joints, the effects of aging on intermetallic layer growth, and the effects of mechanical cycling fatigue.
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Journal of Microelectronics and Electronic Packagingno. 1 (2022): 39-47
PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021)pp.904-910, (2021)
PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021)pp.954-959, (2021)
2020 Pan Pacific Microelectronics Symposium (Pan Pacific)pp.1-8, (2020)
Francy John Akkara,Mohammed Abueed,Mohamed Belhadi,Xin Wei,Dr. Sa’d Hamasha, Dr.,Haneen Ali, Dr. Jeff Suhling,Dr. Pradeep Lall
semanticscholar(2020)
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