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个人简介
Florian Janek received the Diploma degree in microsystems and nanotechnology engineering from the University of Applied Sciences at Kaiserslautern, Kaiserslautern, Germany, in 2015. He is currently pursuing the Ph.D. degree in mechanical engineering with the Institute of Micro Assembly Technology, Hahn-Schickard, Stuttgart, Germany.
He is currently a Research Assistant with the Institute of Micro Assembly Technology, Hahn-Schickard. His current research interests include the assembly and embedding of ultrathin chips on flexible substrates.
研究兴趣
论文共 9 篇作者统计合作学者相似作者
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Yannic Brasse, Mariano Laguna Moreno, Simon Blum, Tim Horter,Florian Janek, Kerstin Gläser, Carl Emmerechts, Jean-Michel Clanet, Michèle Verhaert, Benoît Grymonprez, Tobias Kraus
crossref(2024)
Yannic Brasse, Mariano Laguna Moreno, Simon Blum, Tim Horter,Florian Janek, Kerstin Gläser, Carl Emmerechts, Jean-Michel Clanet, Michèle Verhaert, Benoît Grymonprez, Tobias Kraus
RSC Sustainability (2024)
Thomas Guenther, Florian Hausladen, Maximilian Barth, Marcel Roeder,Florian Janek,Dominik Drossart, Holger Wurm, Serhat Sahakalkan, Karl Stock,Andre Zimmermann
MikroSystemTechnik Congress 2021; Congresspp.1-4, (2021)
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 11 (2019): 2314-2319
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 11 (2019): 2314-2319
Marius Wolf,Florian Janek,Thomas Meissner, Benedikt Wigger,Maximilian Barth,Thomas Guenter,Wolfgang Eberhardt,Andre Zimmermann, Volker Geneiss, Tobias Luke,Christian Hedayat,Thomas Otto
2018 13th International Congress Molded Interconnect Devices (MID)pp.1-6, (2018)
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