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Er-Ping Li (Fellow, IEEE) is currently a Changjiang-Distinguished Professor with the Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou, China, and the Dean of the Joint Institute of Zhejiang University–University of Illinois at Urbana–Champaign. Since 1989, he has been a Research Fellow, a Principal Research Engineer, an Associate Professor, and the Technical Director of the Singapore Research Institute and University, Singapore. In 2000, he joined the Institute of High Performance Computing, A*STAR, Singapore, as a Principal Scientist and the Director. He has authored or coauthored over 300 articles published in the refereed international journals and authored two books published by John-Wiley-IEEE Press and Cambridge University Press. He holds and has filed a number of patents at the U.S. patent office. His research interests include electrical modeling and design of microscale/nanoscale integrated circuits, 3-D electronic package integration, and nanoplasmonic technology.
Dr. Li is a fellow of the MIT Electromagnetics Academy, USA. He is a Founding Member of the IEEE MTT-RF Nanotechnology Committee. He has been a general chair and a technical chair for many international conferences. He was a recipient of the 2015 IEEE Richard Stoddard Award on EMC, the IEEE EMC Technical Achievement Award, the Singapore IES Prestigious Engineering Achievement Award, the Changjiang Chair Professorship Award from the Ministry of Education in China, and a number of best paper awards. He was the President of the 2006 International Zurich Symposium on EMC and the Founding General Chair of the Asia-Pacific EMC Symposium, the General Chair of 2008, 2010, 2012, and 2016 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), and the 2010 IEEE Symposium on Electrical Design for Advanced Packaging Systems. He has been invited to give numerous invited talks and plenary speeches at various international conferences and forums. He was elected to the IEEE EMC Distinguished Lecturer in 2007. He served as an Associate Editor for the IEEE Microwave and Wireless Components Letters from 2006 to 2008 and a Guest Editor for IEEE Transactions on Electromagnetic Compatibility Special Issues in 2006 and 2010, and IEEE Transactions on Microwave Theory and Techniques APMC Special Issue in 2010. He is also an Associate Editor of the Transactions on Electromagnetic Compatibility and IEEE Transactions on Components, Packaging and Manufacturing Technology.
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IEEE Trans. Instrum. Meas. (2024): 1-8
Journal of Applied Physicsno. 10 (2024)
IEEE Antennas and Wireless Propagation Lettersno. 99 (2024): 1-5
PROGRESS IN ELECTROMAGNETICS RESEARCH-PIER (2024): 1-18
IEEE Transactions on Signal and Power Integrity (2024): 37-46
IEEE Antennas and Wireless Propagation Lettersno. 99 (2023): 1-5
2023 5th International Conference on Robotics, Intelligent Control and Artificial Intelligence (RICAI)pp.1015-1020, (2023)
2022 PHOTONICS & ELECTROMAGNETICS RESEARCH SYMPOSIUM (PIERS 2022)pp.125-128, (2022)
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