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He has been Program Chair of DDECS 2002, ETS 2006, 3D-TEST 2009-15, and DATE 2013, and General Chair of ETW 2003, DSNOC 2007-08, 3DIW 2009-10, and serves on numerous conference committees, including ATS, DATE, ETS, ITC, ITC-Asia, and VTS. He serves on the editorial boards of IEEE ‘Design & Test’ and Springer’s ‘Journal of Electronic Testing: Theory and Applications’. During the span of his career, Marinissen has supervised 43 international MSc and PhD students. He is Fellow of IEEE, Golden Core Member of IEEE Computer Society, and was elected to serve on the Computer Society’s Board of Governors for the term 2019-2021.
Specialisms: test and debug of integrated circuits; modular SOC testing; test of 3D stacked ICs; automatic test pattern generation (ATPG); built-in self-test (BIST); automated test equipment (ATE); wafer probing, probe technology, probe stations; memory testing.
Specialisms: test and debug of integrated circuits; modular SOC testing; test of 3D stacked ICs; automatic test pattern generation (ATPG); built-in self-test (BIST); automated test equipment (ATE); wafer probing, probe technology, probe stations; memory testing.
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Zhan Gao, Min-Chun Hu,Rogier Baert,Bilal Chehab, Joe Swenton, Santosh Malagi,Jos Huisken,Kees Goossens,Erik Jan Marinissen
IEEE DESIGN & TESTno. 2 (2024): 56-64
IEEE design & testno. 2 (2024): 56-64
ETSpp.1-6, (2023)
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2023 IEEE INTERNATIONAL TEST CONFERENCE IN ASIA, ITC-ASIApp.1-6, (2023)
2023 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, DATEpp.1-6, (2023)
2023 IEEE 41st VLSI Test Symposium (VTS)pp.1-6, (2023)
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2023 IEEE 32ND ASIAN TEST SYMPOSIUM, ATSpp.71-76, (2023)
2023 IEEE International Test Conference in Asia (ITC-Asia)pp.1-1, (2023)
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2023 IEEE International Test Conference (ITC)pp.151-158, (2023)
2023 IEEE International 3D Systems Integration Conference (3DIC)pp.1-6, (2023)
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