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Ercan M. Dede (Member, IEEE) received the B.S. degree in mechanical engineering from the University of Michigan, Ann Arbor, MI, USA, in 1998, the M.S. degree in mechanical engineering from Stanford University, Stanford, CA, USA, in 2002, and the Ph.D. degree in mechanical engineering from the University of Michigan, Ann Arbor, MI, USA, in 2007.
He is currently the Director of Electronics Research Department, the Toyota Research Institute of North America, Ann Arbor, MI, USA. His team focuses on vehicle systems involving advanced sensors, power semiconductors, electronics and photonics packaging, and thermal management technology. He has authored or coauthored more than 100 articles in archival journals and conference proceedings on topics related to the design and structural optimization of thermal, mechanical, and electromagnetic systems. He is one of the authors of a book entitled Multiphysics Simulation: Electromechanical System Applications and Optimization(Springer, 2014). He holds 144 issued patents.
Dr. Dede was the recipient of two R&D 100 Awards for the development of technologies related to next-generation electronics for electrified vehicles. He currently serves as an Associate Editor for the ASME Journal of Electronic Packaging.
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Applied Physics Lettersno. 11 (2024)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2024): 125116
IEEE TRANSACTIONS ON INTELLIGENT TRANSPORTATION SYSTEMSno. 99 (2024): 1-10
ADVANCED MATERIALS INTERFACESno. 30 (2023): n/a-n/a
Journal of the Acoustical Society of Americano. 3_supplement (2023): A75-A75
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-8, (2023)
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IEEE Transactions on Power Electronicsno. 6 (2023): 6790-6794
2023 IEEE WIRELESS POWER TECHNOLOGY CONFERENCE AND EXPO, WPTCEpp.1-5, (2023)
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