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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 108 篇作者统计合作学者相似作者

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Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment
Henry A. Martin,Edsger C. P. Smits,Rene H. Poelma,Willem D. van Driel,GuoQi Zhang
IEEE Transactions on Power Electronicsno. 99 (2024): 1-10
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Hybrid Integration of OPE
Marc Koetse,Edsger Smits, Erik Rubingh, Pit Teunissen, Roel Kusters, Robert Abbel, Jeroen van den Brand
Organic and Printed Electronicspp.453-483, (2024)
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Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
X. Hu, H.A. Martina,R.H. Poelma, J.L. Huang, H. Rijckevorsel, H. Scholten,E.C.P. Smits,W.D. Van Driel,G.Q. Zhang
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-7, (2023)
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In-situ reliability monitoring of power packages using a Thermal Test Chip
H. A. Martin, R. Sattari,E. C. P. Smits,H. W. van Zeijl,W. D. van Driel, G. Q. Zhang
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-10, (2022)
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Active-Matrix IGZO Array with Printed Thermistor for Large-Area Thermal Imaging
Jan-Laurens van der Steen,Laurens C. J. M. Peters,Edsger C. P. Smits,Peter Zalar,Gerwin H. Gelinck
2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)pp.8792229-3, (2019)
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