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个人简介
Internationally recognized packaging process expert in the areas of solder interconnects, Cu-polymer multi-level structures, 2.5 and 3D wafer finishing and assembly. Extensive experience in the development of electronic packages and scale-up to manufacturing. Passionate focus on yield improvements through defect identification and elimination with a clear understanding of the role of tools, materials, process and the human factor. Exceptional ability to rapidly analyze defects in complex processes and structures and quickly determine which areas need to be investigated.
IEEE Fellow in the areas of solder interconnect and multi-level thin films, and recognized industry expert with 2 book chapters, 79 papers, 55 US patents and 8 years as Instructor of the Flip Chip Professional Development Course at the ECTC.
Specialties: Heterogeneous Integration, Packaging Assembly, Solder Interconnect, Chip Package Interaction, Electromigration, 2D/2.5D/3D structures, Interposers, White Bump, UBM selection, Solder Characterization, WPL, Quality, Reliability, Yield Improvements, FMEA, Defect Characterization, Root Cause Analysis, Ground Rules, Design for Manufacturing, Process Audits, Cross-Functional Team, Inventions, Patent Reviews, Inspection.
Currently working at IBM Heterogeneous Integration area developing packages for accelerators for AI.
IEEE Fellow in the areas of solder interconnect and multi-level thin films, and recognized industry expert with 2 book chapters, 79 papers, 55 US patents and 8 years as Instructor of the Flip Chip Professional Development Course at the ECTC.
Specialties: Heterogeneous Integration, Packaging Assembly, Solder Interconnect, Chip Package Interaction, Electromigration, 2D/2.5D/3D structures, Interposers, White Bump, UBM selection, Solder Characterization, WPL, Quality, Reliability, Yield Improvements, FMEA, Defect Characterization, Root Cause Analysis, Ground Rules, Design for Manufacturing, Process Audits, Cross-Functional Team, Inventions, Patent Reviews, Inspection.
Currently working at IBM Heterogeneous Integration area developing packages for accelerators for AI.
研究兴趣
论文共 86 篇作者统计合作学者相似作者
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Qianwen Chen,Michael Belyansky,Yasir Sulehria,Akihiro Horibe, Liqiao Qin,Ruturaj Pujari,Eric Perfecto,Fee Li Lie,Shahid Butt, Nick Polomoff,Risa Miyazawa,Sayuri Kohara,
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1175-1180, (2023)
引用0浏览0EIWOS引用
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Mukta Farooq,Arvind Kumar,Sae-Kyu Lee,Ravi Bonam, Juan-Manuel Gomez,James Kelly,Kohji Hosokawa,Akiyo Nomura, Yasuteru Kohda,Timothy Dickson,Katsuyuki Sakuma, Hiroyuki Mori,
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.977-980, (2022)
Katsuyuki Sakuma,Buck Webb,Xiao Hu Liu,John Knickerbocker, Thomas Weiss,Shidong Li,Hongqing Zhang, Conor R. Thomas,Eric Perfecto,Tingge Xu,Hongbing Lu
Timothy H Daubenspeck,Jeffrey P Gambino, Karen P Mclaughlin,Ekta Misra,Christopher D Muzzy,Eric D Perfecto,Wolfgang Sauter
mag(2015)
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Electronic Components and Technology Conferencepp.1940-1943, (2014)
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