基本信息
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Bio
He has received three IBM’s Outstanding Technical Achievement Awards and one Corporate Award, the IBM's highest technical award. He has authored or coauthored more than 100 journal and conference papers. He received the Best Paper Prize of the 2007 IEEE International Workshop on Antenna technology for “Antenna-in-package in LTCC for 60 GHz Radio,” IBM Research's 2011 Pat Goldberg Memorial Best Paper Award in Computer Science, Electrical Engineering and Math for “Organic Packages with Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets,” and the 2012 S. A. Schelkunoff Prize Paper Award of the IEEE Antennas and Propagation Society for “Dual Grid Array Antennas in a Thin-Profile Package for Flip-Chip Interconnection to Highly Integrated 60-GHz Radios,” He has 52 patents issued and 17 patents pending. His research interests are antenna design, EM modeling, chip packaging, digital signal processing, and communications technologies.
Research Interests
Papers共 163 篇Author StatisticsCo-AuthorSimilar Experts
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Bodhisatwa Sadhu,Arun Paidimarri,Atom O. Watanabe,Duixian Liu,Xiaoxiong Gu,Christian W. Baks,Yujiro Tojo, Yoshiharu Fujisaku,Isabel de Sousa, Yo Yamaguichi,Ning Guan,Alberto Valdes-Garcia
IEEE JOURNAL OF MICROWAVESno. 1 (2025): 68-83
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI)pp.1543-1544, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.467-474, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.2101-2107, (2023)
2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI) (2022)
IEEE Journal of Solid-State Circuitsno. 12 (2022): 3599-3616
Electronic Components and Technology Conferencepp.1144-1149, (2021)
IEEE JOURNAL OF MICROWAVESno. 1 (2021): 123-134
user-607cde9d4c775e0497f57189(2020)
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Author Statistics
#Papers: 163
#Citation: 7966
H-Index: 45
G-Index: 85
Sociability: 6
Diversity: 2
Activity: 4
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