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论文共 37 篇作者统计合作学者相似作者

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Fine Pitch Superconducting Interconnects Obtained with Nb–Nb Direct Bonding
Candice Thomas, Pablo Renaud, Meriem Guergour,Edouard Deschaseaux,Christophe Dubarry,Jennifer Guillaume,Elisa Vermande,Alain Campo, Frank Fournel, Hadi Hijazi, Anne-Marie Papon, Catherine Pellissier,Jean Charbonnier
Materials for Quantum Technologyno. 1 (2025): 016001
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Substrate Integrated Waveguide in 3D Integrated Technology for D-Band Applications
Hajar Zidane, Christopher Pouzou,Jordan Corsi,Loic Vincent,Christophe Dubarry,Olivier Valorge, Jean-Daniel Amould,Emmanuel Pistono
2024 19TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE, EUMIC 2024pp.106-109, (2024)
引用0浏览0EIWOS引用
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Die-to-Wafer Hybrid Bonding Impact at MM-Wave Frequencies
Mohammad Alsukour,Olivier Valorge, Margot Faure,Loïc Vincent, Victor Milon,Pascal Chevalier,Emmanuel Pistono,Jean-Daniel Arnould,Christophe Dubarry
IEEE International Conference on 3D System Integrationpp.1-6, (2024)
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Fine Pitch Nb-Nb Direct Bonding for Quantum Applications
Pablo Renaud,Christophe Dubarry,Nicolas Bresson,Edouard Deschaseaux,Frank Fournel,Christophe Morales,Karine Abadie,Candice Thomas,Jean Charbonnier
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.441-446, (2024)
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Characterization of Silicon Substrates for Sub-Thz Electronics, Benefit of the Beatty Resonator Test-Structure
Luca Lucci,Olivier Valorge, Alexandre Oliviera,Herve Boutry,Christophe Dubarry,Fred Gaillard,Blandine Duriez
2024 IEEE 24th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) (2024)
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Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations
Margot Faure,Christophe Dubarry, Pablo Renaud, Floriane Baudin, Sebastien Dominguez,Karine Abadie,Christophe Morales,Constantin Matei,Frank Fournel
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-6, (2024)
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Surface Activated Cu/SiO2 Hybrid Bonding for Room Temperature 3D Integration
K. Abadie, P. Renaud,F. Fournel,L. G. Michaud, M. Danner, M. Dornetshumer,C. Lecouvey,A-M Papon, I. Chevalier, T. Monniez,C. Matei,T. David, S. Dominguez,C. Dubarry
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)pp.1-1, (2024)
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45‐4: MicroLED Display Life Cycle Assessment
Antonin Holo,Christophe Dubarry, João-Carlos Lopes Barbosa, Muriel Dupont, Sandrine Chabaud, François Templier
SID Symposium Digest of Technical Papersno. 1 (2023): 654-657
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作者统计

#Papers: 37

#Citation: 353

H-Index: 10

G-Index: 18

Sociability: 5

Diversity: 2

Activity: 0

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