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Dries Bosman was born in 1995. He received the M.Sc. degree in electrical engineering from Ghent University, Ghent, Belgium, in 2018, where he is currently pursuing the Ph.D. degree in electrical engineering with the IDLab, Electromagnetics Group, Department of Information Technology.
His current research interests include computational electromagnetics, in particular the modeling of through silicon vias.
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论文共 11 篇作者统计合作学者相似作者
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2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)pp.1-4, (2023)
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2023 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION, NEMOpp.1-4, (2023)
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 10 (2023): 1567-1575
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2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2022)
2022 IEEE 26th Workshop on Signal and Power Integrity (SPI)pp.1-4, (2022)
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