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个人简介
Donghun Lee received the B.S. and M.S. degrees in electronic engineering from Hanyang University, Ansan-si, South Korea, in 1998 and 2000, respectively, where he is currently pursuing the Ph.D. degree.
In 2000, he joined Samsung Electronics Inc., Suwon-si, South Korea, where he was involved in the research and development of a Gigabit Ethernet device. From 2001 to 2019, he developed CMOS image sensor circuits and the signal integrity verification methodology of integrated circuit and systems as a Principal Engineer with Samsung Electronics. In 2019, he joined WiPAM CO., Ltd., where he was involved in the RF Component Design Group, Seongnam-si, South Korea. His current research interests include microwave circuit design and high-frequency characterizations of integrated electronic system.
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IEEE Journal of Solid-State Circuitsno. 1 (2011): 236-247
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