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个人简介
Debayan Das (Student Member, IEEE) received the bachelor’s degree in electronics and telecommunication engineering from Jadavpur University, Kolkata, India, in 2015. He is currently pursuing the Ph.D. degree in electrical and computer engineering with Purdue University, West Lafayette, IN, USA, working with Prof. Shreyas Sen.
Prior to joining the Ph.D. degree, he worked as an analog design engineer at a startup based in India. He has interned with the Security Research Lab, Intel Labs, Hillsboro, OR, USA, over the summers of 2018 and 2020. He has authored/coauthored more than 30 peer-reviewed conferences and journals, including two book chapters and one U.S. patent. His research interests include mixed-signal IC design and hardware security.
Mr. Das was a recipient of the IEEE International Symposium on Hardware Oriented Security and Trust (HOST) Best Student Paper Awards in 2017 and 2019 and the 3rd Best Poster Award in the IEEE HOST 2018. In 2019, one of his papers was recognized as a Top Pick in Hardware & Embedded Security published over the span of the last six years. During his Ph.D. degree, he has been awarded the ECE Fellowship from 2016 to 2018 and the Bilsland Dissertation Fellowship during the final year (2020–2021) for his outstanding overall achievements. He has been serving as a Primary Reviewer for multiple reputed journals and conferences, including IEEE Transactions on Circuits and Systems—I: Regular Papers (TCAS-I), IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), ACM Transactions on Design Automation of Electronic Systems (TODAES), IEEE Access, IEEE Internet of Things Journal (IoTJ), IEEE Engineering in Medicine and Biology Society (EMBC), and ACM Design Automation Conference (DAC).
研究兴趣
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Harshit Saurabh,Anupam Golder, Samarth Shivakumar Titti, Suparna Kundu, Chaoyun Li,Angshuman Karmakar,Debayan Das
arxiv(2024)
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International Conference on VLSI Designpp.443-448, (2024)
IEEE Open Journal of Circuits and Systems (2023): 271-282
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arXiv (Cornell University) (2023)
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IEEE JOURNAL OF SOLID-STATE CIRCUITSno. 8 (2023): 2383-2398
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IEEE Journal of Solid-State Circuitspp.1-16, (2023)
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IEEE J. Solid State Circuitsno. 8 (2023): 2383-2398
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DACpp.1-6, (2023)
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