基本信息
浏览量:28
职业迁徙
个人简介
His research program intersects thermal and materials sciences, with primary application in creating solutions for enabling high power dense and reliable electronics. This includes novel material and manufacturing approaches to thermal management of power electronics in electric aircraft and automobiles, as well as development of materials and process methodologies for multifunctional packaging architectures for heat dissipation and structural stability in extending device lifetimes.
研究兴趣
论文共 122 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Ange-Christian Iradukunda, Bakhtiyar M. Nafis,David Huitink,Yuxiang Chen,H. Alan Mantooth, Geoff Campbell, David Underwood
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
SUSTAINABILITYno. 4 (2023): 3451-3451
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-5, (2023)
引用0浏览0EIWOS引用
0
0
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSno. 10 (2023)
JOURNAL OF MATERIALS SCIENCEno. 18 (2023): 7673-7689
JOURNAL OF ELECTRONIC PACKAGINGno. 4 (2023)
加载更多
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn