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He has authored or coauthored over 200 international journal papers (cited in the Web of Science), and 200 papers in conference proceedings. His research interests include circuit and electromagnetic modeling of high-speed and high-frequency interconnections and packaging, on electromagnetic compatibility and numerical solutions of Maxwells equations.,Dr. Zutter was an Associate Editor of the IEEE Transactions on Microwave Theory and Techniques.
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2023 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION, NEMOpp.1-4, (2023)
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 10 (2023): 1567-1575
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2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2022)
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