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个人简介
Clark Hu received the B.S. degree in mechanical engineering from National Cheng Kung University, Tainan, Taiwan, in 1993, and the M.S. degree in power mechanical engineering from National Tsing Hua University, Hsinchu, Taiwan, in 1995.
From 2000 to 2009, he was with TSMC, Hsinchu, where he was involved front-end semiconductor process integration and device reliability and joined the Research and Development of Advanced Package Division in 2009.
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P. K. Huang, C. Y. Lu, W. H. Wei,Christine Chiu, K. C. Ting,Clark Hu,C. H. Tsai,S. Y. Hou,W. C. Chiou, C. T. Wang,Douglas Yu
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.101-104, (2021)
Shang-Yun Hou,W. Chris Chen,Clark Hu,Christine Chiu, K. C. Ting, T. S. Lin, W. H. Wei,W. C. Chiou, Vic J. C. Lin,Victor C. Y. Chang, C.-T. Wang,Chung-Cheng Wu,
W. Chris Chen,Clark Hu, K. C. Ting, Vincent Wei, T. H. Yu,S. Y. Huang, V.C.Y. Chang, C. T. Wang,S. Y. Hou,C. H. Wu, Doug Yu
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D-Core
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