基本信息
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职业迁徙
个人简介
Research Topics
1.CMOS Image Sensor / (Strained) Si CMOS and Si/SiGe HBT Design
2.Strained-Si / Ge FET Process
3.Device Modeling and Simulation
4.CMOS Optoelectronics (including source, detector, and waveguide)
5.Materials (SOI, GOI, SSDOI using smart cut, wafer bonding, and nano-mechanics)
6.Reliability and Modeling of Poly-Si TFTs
7.Solar Cell
8.Optical Communication Front-end and Optical Interconnect
1.CMOS Image Sensor / (Strained) Si CMOS and Si/SiGe HBT Design
2.Strained-Si / Ge FET Process
3.Device Modeling and Simulation
4.CMOS Optoelectronics (including source, detector, and waveguide)
5.Materials (SOI, GOI, SSDOI using smart cut, wafer bonding, and nano-mechanics)
6.Reliability and Modeling of Poly-Si TFTs
7.Solar Cell
8.Optical Communication Front-end and Optical Interconnect
研究兴趣
论文共 510 篇作者统计合作学者相似作者
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Wan-Hsuan Hsieh,Yu-Rui Chen,Yi-Chun Liu,Zefu Zhao, Jia-Yang Lee,Chien-Te Tu,Bo-Wei Huang,Jer-Fu Wang, M. H. Lee,C. W. Liu
IEEE TRANSACTIONS ON ELECTRON DEVICES (2024)
Asim Senapati,Zhao-Feng Lou, Jia-Yang Lee,Yi-Pin Chen, Shih-Yin Huang,Siddheswar Maikap,Min-Hung Lee,Chee-Wee Liu
IEEE Electron Device Lettersno. 99 (2024): 1-1
SEMICONDUCTOR SCIENCE AND TECHNOLOGYno. 5 (2024)
Hung-Chun Chou,Tao Chou,Shee-Jier Chueh,Sun-Rong Jan,Bo-Wei Huang,Chien-Te Tu,Yi-Chun Liu, Li-Kai Wang,C. W. Liu
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)pp.1-1, (2023)
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IEEE TRANSACTIONS ON ELECTRON DEVICESno. 8 (2023): 4194-4197
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Communications Engineeringno. 1 (2023): 1-9
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)pp.1-2, (2023)
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IEEE TRANSACTIONS ON ELECTRON DEVICES (2023)
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