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Chandrasekharan Nair received the Bachelor’s degree in polymer engineering and Technology from the Institute of Chemical Technology, Mumbai, India, in 2013 with a minor in chemical engineering. He is currently pursuing the Ph.D. degree in materials science and engineering with the 3D Packaging Research Center, Georgia Institute of Technology (Georgia Tech), Atlanta, GA, USA, under the guidance of Prof. Rao Tummala.
He is a Graduate Research Assistant with the Low Cost Glass Interposer Program, Georgia Tech, where he is involved in the reliability evaluation of novel polymer dielectric materials and processes to build next-generation redistribution layer for panel scale interposers/high-density packages. His current research interests include polymer–metal interfaces, package substrate reliability studies, and polymer characterization.
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论文共 25 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 4 (2023): 570-579
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 7 (2019): 1426-1433
Bartlet DeProspo,Aya Momozawa,Atsushi Kubo,Chandrasekharan Nair, Varun Rajagoapal, Jenefa Kannan, Emanuel Surillo,Fuhan Liu, Mohananlingam Kathaperumal,Rao Tummala
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 10 (2019): 2016-2023
IEEE Transactions on Components, Packaging and Manufacturing Technologypp.1-1, (2019)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 5 (2018): 792-801
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