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论文共 467 篇作者统计合作学者相似作者

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A New Catechol of Cucurbita Pepo
C. Y. Chen, Q. E. Hsieh,C. L. Kao,M. J. Cheng,H. T. Li
Chemistry of Natural Compoundspp.1-3, (2025)
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Hybrid Bonding of Cu and Manganin by Using IPA-VUV Irradiation
Fu-Ling Chang,C. Robert Kao,Akitsu Shigetou
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)pp.89-90, (2025)
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Solder Joint Reliability Comparison under JEDEC Drop and System-Like Drop Test Conditions
Meng-Kai Shih, Zih-Jun Ke, Chun-Yu Yen,Wei-Hong Lai,Chin-Li Kao
2024 International Conference on Electronics Packaging (ICEP)pp.153-154, (2024)
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High Acceleration Dynamic Methodology for Board-Level Shock Solder Joint Reliability Approach
Min-Cheng Yu,Nan-Yi Wu, Wu-Lung Wang,Hsin-Chih Shih,Wei-Hong Lai,Chin-Li Kao,Chen-Chao Wang,C. P. Hung
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1213-1218, (2024)
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Diffusion and Marker Experiments for the Newly Discovered CuIn2 Compound
Yu-Hsin Lin,Fu-Ling Chang, Chen, Pei-Kang Wu,C. R. Kao
MATERIALS CHARACTERIZATION (2024)
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Large-Scale Cu Interconnection of Organic Substrate Materials Through Electroless Plating Technology
M. L. Shih,P. S. Shih,J. H. Huang,I. A. Chen, J. S. Wang,C. T. Ko, B. R. Lin, K. M. Yang, C. H. Lin, A. S. Lee,C. R. Kao
2024 International Conference on Electronics Packaging (ICEP)pp.1-2, (2024)
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Experimental and Numerical Investigation on Dynamic Response of Flip Chip Package under Board Level Drop Test
Chun-Yu Yen,Chin-Li Kao,Wei-Hong Lai, Chi-Wei Wang, Hsueh-Chih Liu,Pei-Chen Huang,Zhen-Wei Zhuang,De-Shin Liu
2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.307-310, (2024)
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Investigation of Wafer Warpage Evolution Baesd on Fan-Out Chip-first Process
Hung-Chun Yang,Wei-Hong Lai,Chin-Li Kao,Chen-Chao Wang,Chih-Pin Hung
2024 International Conference on Electronics Packaging (ICEP)pp.151-152, (2024)
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作者统计

#Papers: 481

#Citation: 9134

H-Index: 51

G-Index: 78

Sociability: 6

Diversity: 3

Activity: 51

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