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Brian Bell IBM Corporation, Rochester, MN 55901 USA (bdbell@us.ibm.com). Mr. Bell received a B.S./M.S. degree in computer engineering from the Rochester Institute of Technology, Rochester, NY, USA, in 1996. He is currently a Senior Engineer with IBM Systems, Rochester. In his 23-year career with IBM, he worked on the physical design and integration of IBM and client processors and support chips including the IBM Z system controller/L4 cache chip. He is currently working on the integration and physical design of the next generation power processor.
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