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Asif Imran Emon (Graduate Student Member, IEEE) received the B.Sc. degree in electrical and electronic engineering from the Chittagong University of Engineering and Technology (CUET), Chittagong, Bangladesh, in 2015, and the M.S. degree with a concentration in high-density power electronics packaging from the University of Arkansas, Fayetteville, AR, USA, in 2020. He is currently pursuing the Ph.D. degree with Stony Brook University (SUNY Stony Brook), Stony Brook, NY, USA.
He was an Intern with GE Global Research, Niskayuna, NY, USA, during the summer of 2021, and Apple Inc., Cupertino, CA, USA, in 2022, for seven months. His research interests include power module packaging of wide bandgap devices, efficient energy conversion, and electromagnetic interference and compatibility analysis in motor drives.
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论文共 54 篇作者统计合作学者相似作者
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IEEE Journal of Emerging and Selected Topics in Power Electronicspp.1-1, (2024)
IEEE Transactions on Industry Applicationsno. 99 (2024): 1-19
IEEE Journal of Emerging and Selected Topics in Power Electronicsno. 99 (2024): 1-1
2023 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APECpp.977-983, (2023)
IEEE Journal of Emerging and Selected Topics in Power Electronicsno. 5 (2023): 4918-4928
2023 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APECpp.854-861, (2023)
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IMAPS symposia and conferencesno. Issue 1 (2023)
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Yang Li, Mustafeez Hassan,Yuxuan Wu,Asif Imran Emon, Yang Xie,Shiyue Deng,Fang Luo,Amol Deshpande,Zhao Yuan,Michael McKeown
2023 IEEE Applied Power Electronics Conference and Exposition (APEC)pp.331-335, (2023)
IEEE Transactions on Industry Applicationsno. 4 (2023): 4199-4214
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