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Antonio Ciccomancini Scogna (M’00–SM’09) received the Ph.D. degree in electrical engineering from the University of L’Aquila, L’Aquila, Italy, in 2004.
From 2004 to 2013, he was with Computer Simulation Technology of America, Framingham, MA, USA, where he was the Principal Application Engineer and later the EDA Market Development Manager. He was a Signal and Power Integrity Scientist with the Silicon Engineering Group, Apple, Cupertino, CA, USA. He is currently a Principal Engineer with the Mobile Communication Business Division, Samsung Electronics, Suwon, South Korea. His current research interests include signal and power integrity for high-speed digital and mixed signal, electromagnetic compatibility/electromagnetic interference, new technologies for power consumption, noise mitigation, and radio frequency interference/desense modeling methodologies.
Dr. Scogna is an Associate Editor of the IEEE Transactions on Electromagnetic Compatibility and serves as a reviewer for a number of journal transactions and international conferences.
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2018 JOINT IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND 2018 IEEE ASIA-PACIFIC SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC/APEMC)pp.18-23, (2018)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 4 (2018): 554-561
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