A. Munding

Andreas Munding received the Diploma degree in electrical engineering and the Ph.D. degree in engineering science from the University of Ulm, Ulm, Germany, in 2002 and 2007, respectively. He studied electrical engineering at the University of Ulm, and Queen’s University, Kingston, ON, Canada. He conducted research in the fields of chemical vapor deposition (CVD) diamond MEMS, 3-D integration, and Cu/Sn diffusion soldering and packaging at the University of Ulm and the Vestfold University College, Horten, Norway. In 2007, he joined Liebherr-Elektronik GmbH, Lindau, Germany, as the Research Project Leader for power electronics system integration. In 2011, he joined Infineon Technologies AG, Regensburg, Germany, where he is currently the Senior Project Leader for innovative package development. He contributed to funded projects, such as VisionIC (BMBF), EfA (BMWi), ProPower (BMBF), and eRamp (ECSEL JU). He has authored or coauthored more than 30 publications, including five patents and a book Wafer Level 3D-ICs Process Technology (Springer, 2008).